this is information on a product in full production. may 2014 docid026350 rev 1 1/7 CBTVS2A12-1F3 circuit breaker with transient voltage suppressor datasheet - production data figure 1. pin configuration (bump side) figure 2. configuration (a) features ? transient voltage suppressor (tvs) ? non-resettable over current protection (ocp) ? electrostatic discharge protection ? electrical overstress protection (ovp) ? unidirectional device ? fast response time ? very thin package: 0.4 mm ? high esd protection level ? high integration ? suitable for high density boards complies with the following standards: ? iec 61000-4-2 level 4: ? 15 kv (air discharge) ? 15 kv (contact discharge) description the CBTVS2A12-1F3 is a single line diode tvs integrating a fuse designed specifically for the protection of integrated circuits in portable equipment and miniaturized electronics devices subject to esd, ovp and ocp. a. b1 and b2 bumps must be grounded on the pcb together. flip chip (4 bumps) b 1 2 a $ $ % * 1 ' % * 1 ' & k d u j h u l q s x w 7 r 3 r z h u 0 d q d j h p h q w , & 1 r q u h v h w w d e o h i x v h www.st.com
characteristics CBTVS2A12-1F3 2/7 docid026350 rev 1 1 characteristics figure 3. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter test condition value unit v pp peak pulse voltage iec 61000-4-2 contact discharge 15 kv iec 61000-4-2 air discharge 15 p pp peak pulse power dissipation 10/1000 s pulse, on a2-b2, t j = t amb 44 w 8/20 s pulse, on a2-b2, t j = t amb 350 t j maximum operating junction temperature 125 c t stg storage temperature range -55 to +150 c table 2. electrical characteristics (at operating temperature: t op = -30 c to +85 c, unless otherwise specified) symbol test conditions min. typ. max. unit v br i r = 1 ma, t amb = 25 c 12 v i rm v rm = 10 v, at t amb = 25 c 100 na v cl i pp = 1 a, 8/20 s pulse waveform, between a1-b1 at t amb = 25 c 15 v v f i f = 850 ma, between a1-b1 1.4 v c line v r = 0 v, v osc = 30 mv, f = 1 mhz 180 pf r a1-a2 at t amb = 25 c at 100 ma 50 m r a1-a2 after fused 1 m t fuse at 5 a (maximum opening time) a 1 -a 2, a 2 -a 1 100 ms t fuse2 at 3.2 a, a 1 -a 2, a 2 -a 1 24 hours t fuse lifetime i dc = 2 a (continuous current) at t amb = 25 c 500 hours i v i f i rm i pp v rm v f v br v cl symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = forward current i = peak pulse current i = breakdown current v = forward voltage drop br rm rm rm pp r f v = clamping voltage r = dynamic impedance cl d f slope = 1/rd
docid026350 rev 1 3/7 CBTVS2A12-1F3 characteristics 7 figure 4. clamping voltage versus peak pulse current (typical values) figure 5. forward voltage drop versus peak forward current (typical values) 0.1 1 10 100 13.5 14.5 15.5 16.5 17.5 18.5 19.5 i pp (a) v cl (v) 8/20s tj initial = 25 c a1/b1 a2/b2 0.0001 0.001 0.01 0.1 1 10 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2 i fm (a) v fm (v) tj initial = 25 c a1/b1 a2/b2 figure 6. frequency response figure 7. junction capacitance versus reverse applied voltage (typical values) 1m 3m 10m 30m 3g -50 -40 -30 -20 0 s21 (db ) f (hz) 100m 300m 1g 300k -10 0.0 20.0 40.0 60.0 80.0 100.0 120.0 140.0 160.0 180.0 200.0 024681012 c (pf) v r (v) figure 8. esd response to iec 61000-4-2 (+8 kv contact discharge) figure 9. esd response to iec 61000-4-2 (-8 kv contact discharge) 200 ns/div 5.0 v/di v 200 ns/div 5.0 v/di v
ordering information scheme CBTVS2A12-1F3 4/7 docid026350 rev 1 2 ordering information scheme figure 10. ordering information scheme & % 7 9 6 $ ) & l u f x l w e u h d n h u 7 u d q v l h q w y r o w d j h v x s s u h v v r u % u h d n g r z q y r o w d j h 1 x p e h u r i o l q h v 3 d f n d j h 9 v l q j o h o l q h ) ) o l s & k l s o 0 , 1 h d g i u h h s l w f k ? p
docid026350 rev 1 5/7 CBTVS2A12-1F3 package information 7 3 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. package dimensions figure 14. tape and reel specifications figure 12. foot print recommendations figure 13. marking 185 m 10 185 m 10 0.77 mm 30 m 0.77 mm 30 m 400 m 40 255 m 40 205 m 40 400 m 40 400 m 50 220 m recommended 220 m recommended 260 m maximum solder stencil opening: copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot xx = marking yww = datecode (y = year ww = week) z = manufacturing location user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 0.3 2.0 0.1 1.75 0.1 3.5 - 0.05 ? 1.55 0.05 0.69 0.05 0.20 0.05 0.87 0.05 xxz yww xxz yww xxz yww xxz yww xxz yww xxz yww xxz yww 0.87 0.05
ordering information CBTVS2A12-1F3 6/7 docid026350 rev 1 note: more information is available in the application notes: an2348: ?400 m flip chip: package description and recommendations for use? an1751: "emi filters: recommendations and measurements" 4 ordering information 5 revision history table 3. ordering information order code marking package weight base qty delivery mode CBTVS2A12-1F3 eb flip chip 0.659 mg 10 000 tape and reel (7?) table 4. document revision history date revision changes 19-may-2014 1 initial release.
docid026350 rev 1 7/7 CBTVS2A12-1F3 7 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com
|
